Supplement No. 6 to Part 740—Approved Integrated Circuit Designers

Note: See Note 1 to ECCN 3A090.a.

Advanced Micro Devices, Inc.;

Alphabet, Inc.;

Amazon.com, Inc.;

Analog Devices, Inc.;

Apple, Inc.;

BAE Systems, Inc.;

Block, Inc.;

The Boeing Company;

Broadcom, Inc.;

Cerebras Systems, Inc.;

Cisco Systems, Inc.;

Hewlett Packard Enterprise Company;

Honeywell International, Inc.;

Infineon Technologies AG;

Intel Corporation;

International Business Machines Corporation (IBM);

L3Harris Technologies, Inc.;

Marvell Technology, Inc.;

MediaTek, Inc.;

Meta Platforms, Inc.;

Micron Technology, Inc.;

Microsoft Corporation;

Mitsubishi Group;

Nokia Corporation;

Nvidia Corporation;

NXP Semiconductors NV;

Qualcomm, Inc.;

Raytheon Company;

Realtek Semiconductor Corporation;

Sony Group Corporation;

Tesla, Inc.;

Texas Instruments; and

Western Digital Technologies, Inc.

[90 FR 5310, Jan. 16, 2025]